晶片內冷卻技術對 Vertiv 及資料中心散熱的長期影響

大叔美股筆記 Uncle Stock Notes

Sep 24

微軟的微流控技術突破

7 Comments

Two phase direct to chip or immersion liquid cooling is the future for chip with TDP above 2kW.

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大叔美股筆記 Uncle Stock Notes

exactly

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大人物开始自备法宝，打通环节，

压缩中间层

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谢谢大叔的宝贵资源！

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感謝大叔和團隊，分析確是詳盡專業，長了知識唷🙏🏻🙏🏻

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上次亞馬遜這次微軟,看起來VRT要更拚了!!

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大叔美股筆記 Uncle Stock Notes

不怕

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